Tag Archives: Electron and Ion Microscopy

All things electron & ion microscopy

ZEISS optics have landed on the ISS

A team at Frankfurt’s Goethe University developed experiments to be performed in space

Alexander Gerst aboard the ISS with the three experiments in the space competition.

A team at Frankfurt’s Goethe University aims to perform experiments in space to gain insights into how our solar system was formed. Experimental Chondrule Formation aboard the ISS (EXCISS) is the name of the project which began its space mission on 17 November in a Cygnus transporter aboard the Antares rocket. It left the space station on Wallops Island, Virginia (USA) and has now arrived at the International Space Station.


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The solar cells of the future

Oak Ridge National Labs researchers use ZEISS ORION NanoFab SIMS to characterize perovskite photovoltaic films

Perovskite solar cells

Solar cells made out of a perovskite-structured compound are the fastest-growing solar technology to date. Compared to traditional silicon solar cells, the raw materials used are cheap to produce, simple to manufacture, and their efficiencies are very high making them commercially attractive and a very promising material for high-efficiency optoelectronic applications. Very recently, researchers from the US Department of Energy’s Oak Ridge National Laboratory in Tennessee have employed a unique combination of imaging and characterization tools and atomic-level simulations to solve a longstanding debate about the internal structure of these fascinating materials.


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University Liège becomes labs@location Partner for ZEISS

Providing in depth knowledge and dedicated services

University Liège

GeMMe of University Liège, Belgium is now a labs@location partner of ZEISS. Focusing on the circular economy, construction materials, process mineralogy, geometallurgy as well as extractive metallurgy & recycling. Professor Pirard and his team use a correlative setup from ZEISS incorporating a ZEISS Sigma 300 FE-SEM with Mineralogic Mining software, SEM mounted µXRF system and ZEISS Axio Imager research grade polarization light microscope to understand important topics in the mining value chain. This analytical powerhouse is the only such setup in Europe to date.


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Sharing knowledge

A day in Boston

Sven_Terclavers

His job is unique. Sven Terclavers is an imaging specialist at ZEISS Microscopy. Working on behalf of the Harvard Center for Biological Imaging, he is responsible for 13 microscope systems and provides consulta­tion for scientists on the proper use of these instruments. He also supports the ZEISS 3D Imaging Specialists Sales team.


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A new way of FIB-processing

Creating TEM lamellae with the new Ion-sculptor FIB column of ZEISS Crossbeam

TEM lamellae

The Ion-sculptor FIB column of the ZEISS Crossbeam FIB-SEM introduces a new way of FIB-processing. By minimizing sample damage you’ll maximize sample quality and perform experiments faster at the same time. When preparing TEM lamellae use the low voltage capabilities of the Ion-sculptor FIB: get ultra-thin samples while keeping amorphization damage at a minimum.


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Push the boundaries – upgrade your microscope

Additional functionality, improved performance or extended lifetime

Upgrade_microscope

Demanding imaging tasks require to make the most of your valuable ZEISS system. Additionally, the questions you are asking develop and change over time.
Watch the video and discover how your highly modular ZEISS system can grow with your needs. See how upgrades and updates give you additional functionality, improved performance and extended lifetime.


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“I am impressed time and again by the many applications of microscopy”

Anita_Sonnenfroh_ZEISS_Iberia

Anita Sonnenfroh is heading the ZEISS sales and service company in Iberia, which brings together the Microscopy, Industrial Metrology and Medical Technology business groups.

Her many experiences over the years and numerous extraordinary moments have caused her fascination for microscopy to grow. Read the interview here:

How ZEISS microscopes support chip manufacturers

Looking inside structures of failed devices and finding out why they failed

Chip-manufacturers_Circuit-board_3

ZEISS light, electron and ion microscopes are used throughout the manufacturing process for 2D and 3D surface imaging, to measure volumes just as well as linear dimensions or cross sections. Another common use for 3D imaging is failure analysis. Chip manufacturers use ZEISS technology to look inside structures of failed devices for clues to why they failed, helping to create more stable and reliable products for the future.


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