A day in Boston
His job is unique. Sven Terclavers is an imaging specialist at ZEISS Microscopy. Working on behalf of the Harvard Center for Biological Imaging, he is responsible for 13 microscope systems and provides consultation for scientists on the proper use of these instruments. He also supports the ZEISS 3D Imaging Specialists Sales team.
Creating TEM lamellae with the new Ion-sculptor FIB column of ZEISS Crossbeam
The Ion-sculptor FIB column of the ZEISS Crossbeam FIB-SEM introduces a new way of FIB-processing. By minimizing sample damage you’ll maximize sample quality and perform experiments faster at the same time. When preparing TEM lamellae use the low voltage capabilities of the Ion-sculptor FIB: get ultra-thin samples while keeping amorphization damage at a minimum.
Additional functionality, improved performance or extended lifetime
Demanding imaging tasks require to make the most of your valuable ZEISS system. Additionally, the questions you are asking develop and change over time.
Watch the video and discover how your highly modular ZEISS system can grow with your needs. See how upgrades and updates give you additional functionality, improved performance and extended lifetime.
Anita Sonnenfroh is heading the ZEISS sales and service company in Iberia, which brings together the Microscopy, Industrial Metrology and Medical Technology business groups.
Her many experiences over the years and numerous extraordinary moments have caused her fascination for microscopy to grow. Read the interview here:
Researching Alport syndrome with ZEISS multibeam ion microscopy
A ZEISS team in Peabody, USA is hard at work developing the multibeam ion microscope ZEISS ORION NanoFab. This instrument makes it possible to uncover kidney diseases that previously remained a mystery – a technique that can save lives.
Using microscopy to identify new materials
In the hunt for new materials, robust and efficient materials characterization is crucial: Learn how to combine the right instruments, techniques, and workflows.
Looking inside structures of failed devices and finding out why they failed
ZEISS light, electron and ion microscopes are used throughout the manufacturing process for 2D and 3D surface imaging, to measure volumes just as well as linear dimensions or cross sections. Another common use for 3D imaging is failure analysis. Chip manufacturers use ZEISS technology to look inside structures of failed devices for clues to why they failed, helping to create more stable and reliable products for the future.
Research reveals meteorites found in Sudan in 2008 are remnants of lost planet
Using ZEISS FIB-SEM technology, Swiss, French, and German scientists observed fragments of a meteorite that crashed into Earth more than a decade ago. They discovered it contained tiny gems that formed deep inside a lost planet from the early days of the solar system at least 4.55 billion years ago.
Exploring advances in high-resolution and in situ imaging
During the webinar, the speakers will:
- Review the latest advances in nanoscale 3D printed lattice structures
- Present their own work involving SEM and HIM imaging methods to characterize nanolattice structures.
- Describe the use of nondestructive 3D X-ray imaging methods
- Discuss future directions for in situ imaging
- Answer questions during the live broadcast!
Experiencing the broad spectrum of ZEISS microscopes
Following expansion and renovation, the ZEISS Microscopy Customer Center Tokyo reopened in April 2018. Around 45 customers from industry and academia attended the grand ceremony. Dr. Kaoru Sato from JFE Techno-Research Corporation, one of Japan’s most well versed experts in electron microscopy, expressed his future expectations for ZEISS in a speech. After the ribbon-cutting ceremony, ZEISS offered tours of the center.