Looking inside structures of failed devices and finding out why they failed
ZEISS light, electron and ion microscopes are used throughout the manufacturing process for 2D and 3D surface imaging, to measure volumes just as well as linear dimensions or cross sections. Another common use for 3D imaging is failure analysis. Chip manufacturers use ZEISS technology to look inside structures of failed devices for clues to why they failed, helping to create more stable and reliable products for the future.
Exploring advances in high-resolution and in situ imaging
During the webinar, the speakers will:
- Review the latest advances in nanoscale 3D printed lattice structures
- Present their own work involving SEM and HIM imaging methods to characterize nanolattice structures.
- Describe the use of nondestructive 3D X-ray imaging methods
- Discuss future directions for in situ imaging
- Answer questions during the live broadcast!
Experiencing the broad spectrum of ZEISS microscopes
Following expansion and renovation, the ZEISS Microscopy Customer Center Tokyo reopened in April 2018. Around 45 customers from industry and academia attended the grand ceremony. Dr. Kaoru Sato from JFE Techno-Research Corporation, one of Japan’s most well versed experts in electron microscopy, expressed his future expectations for ZEISS in a speech. After the ribbon-cutting ceremony, ZEISS offered tours of the center.
Supporting customers in the Asia-Pacific region
The opening of the ZEISS Microscopy APAC Support Center (ASC) in Shanghai is another milestone for ZEISS Microscopy to enable and support customers in the increasingly important and growing APAC region. “We can only ensure sustainable growth if we’re in a position to deliver the services our customers need quickly and effectively,” says Alex Cheong, Regional Service Manager APAC for ZEISS Microscopy.
ZEISS Xradia Context microCT offers full context, large field of view, and high throughput imaging
ZEISS has now expanded its portfolio of lab X-ray imaging instruments with a new micro-computed tomography (microCT) system: ZEISS Xradia Context microCT will expand the offering with full context, large field of view, and high throughput imaging, while ZEISS Xradia Versa and Xradia Ultra X-ray microscopes will continue to address challenging 3D imaging problems, particularly when high-resolution needs are paramount. ZEISS Xradia Context microCT will enable users to image objects both large and small, addressing the broad range of computed tomography applications with a foundation built on the high performance and high data quality for which ZEISS Xradia has become known.
Iterative reconstruction with ZEISS OptiRecon
The new module for the ZEISS Xradia Versa 500-series of 3D X-ray microscopes (XRM) will allow users to acquire high quality images in one-quarter the time: ZEISS OptiRecon uses a new, advanced iterative reconstruction technique. Now you can make the optimal choice for your requirements: same quality images four times faster, or superior quality in the same amount of time as standard image acquisition.
ZEISS and Microscopy & Analysis present free guide
This publication offers an overview of the latest 3D X-ray microscopy technology and its unique advantages. As you explore its pages, you will meet key researchers – particularly in the field of materials science – at some of the world-leading research facilities and laboratories who use XRM to meet their needs for flexible, high-resolution 3D and 4D imaging.
The X-ray microtomography lab at Luleå University of Technology (LTU), Sweden shares interesting insights
The research goal at the X-ray microtomography lab at Luleå University of Technology (LTU), Sweden is to develop methods and tools that help us better understand heterogeneous materials and how they behave in different environments, and at different spatial scales.
The snow sample represents fresh snow acquired only minutes after snowfall. The width of the snow crystal is approximately 0.85 mm. The width (diameter) of the center tunnel ranges from 60 micron (at the entrance) to 220 micron on the opposite side.
Center of Nanoanalysis and Electron Microscopy (CENEM) at the Friedrich-Alexander-University Erlangen-Nuremberg delighted with new research tool
The Center of Nanoanalysis and Electron Microscopy at the Friedrich-Alexander-University Erlangen-Nuremberg recently opened its doors for the inauguration of their new ZEISS Xradia Ultra X-ray microscope.
ZEISS presents an update of LabDCT – its diffraction contrast tomography module for the ZEISS Xradia 520 Versa X-ray microscope. This imaging and analytical technique is used to obtain crystallographic information on metal alloys or polycrystalline materials. It enables non-destructive mapping of orientation and microstructure. With LabDCT, ZEISS takes diffraction contrast tomography out of the exclusive realm of the synchrotron and extends it right into the researcher’s laboratory.